Qualcomm on Monday unveiled Snapdragon 810 and Snapdragon 808, its next generation 64-bit flagship processors for smartphones and tablets, claiming them to be its “highest performing” processors to date.
The Qualcomm Snapdragon 810 and 808 will be integrated with the company’s fourth-generation Cat 6 LTE Advanced multimode modem and Adreno graphics processors along with support for its RF360 front end and 3x20MHz carrier aggregation.
“Both processors are designed in 20nm technology node with Cat 6 LTE, advanced multimedia features and 64-bit capability, all tightly integrated and optimised for low power consumption that does not sacrifice performance, making them the first premium-tier 64-bit processors to enable LTE Advanced globally with a single design,” read the press release.
The Snapdragon 810, claimed as Qualcomm’s “highest performing Snapdragon platform to date” will come with new, faster WiFi features as well as an integrated modem that supports LTE and its successor, LTE-Advanced.
The chip also allows video recording and playback at “4K” ultra-high resolution. It has a built in Adreno 430 graphics processing unit (GPU) which is 30 percent faster on graphics performance and 20 percent more power efficient than the older Adreno 420 GPU.
The Snapdragon 810 will be the first mobile chip to support the latest low-power LPDDR4 memory and also supports Bluetooth 4.1, NFC, and Qualcomm’s location-tracking IZat location core. The chip will also implement the recently unveiled Qualcomm VIVE 2-stream 802.11ac with multi-user MIMO, to increase local connectivity for mobile devices.
The Snapdragon 808 will be packed with a less powerful GPU in the Adreno 418, designed for WQXGA (2,560 x 1,600) displays. It is configured with two ARM Cortex A57 CPU cores and a quad-core ARM Cortex A53 CPU. The Snapdragon 808 features Adreno 418 GPU that offers up to 20 percent faster graphics performance than the Adreno 330 GPU. It will support LPDDR3 memory.
Qualcomm said the Snapdragon 810 and 808 processors will be shipped out to device makers for testing in the second half of this year. The company expects devices with the chips to be available by the first half of 2015.
