Smartphone maker LG has come forward to confirm that it is not facing any overheating issues with Qualcomm’s new Snapdragon processor that is powering one of LG’s curved-screen devices slated to go on sale in South Korea on Jan. 30.
“I am very much aware of the various concerns in the market about the (Snapdragon) 810, but the chip’s performance is quite satisfactory,” said Woo Ram-chan, LG vice president for mobile product planning, at a press event for the company’s G Flex2 smartphone.
The issue came into light recently after Bloomberg reported that Samsung has decided not to use the new Qualcomm processor for the next flagship Galaxy S smartphone after the chip overheated during testing.
“Samsung Electronics Co. will use its own microprocessors in the next version of the Galaxy S smartphone, dropping its use of a Qualcomm Inc. chip that overheated during the Korean company’s testing,” Bloomberg noted.
According to the report, citing unnamed sources with direct knowledge of the matter, Samsung’s upcoming Galaxy S smartphone, due to be released in March, will come equipped with the company’s own processors.
LG’s Woo on Thursday said that internal tests for the G Flex2, which is powered by the new Qualcomm processor, show that the new product emits less heat than other existing devices.
“I don’t understand why there is an issue over heat,” he said.
