Rumours and speculations of the much-awaited Apple’s iPhone 6 will keep popping up every now and then, until the official launch, and the latest leak comes from the Chinese shores, showcasing the purported logic board of the device.
NoWhereElse has managed to grab a few “particularly reliable” images of the alleged logic board of the iPhone 6, claiming the motherboard to feature an ultra-fast 802.11ac Wi-Fi and a Near Field Communication chip onboard.
Citing sources from China, NoWhereElse reports the iPhone 6 to pack NFC and Wi-Fi (802.11ac) support, but MacRumours notes that the presence of both NFC and Wi-Fi (802.11ac) can’t be confirmed with the leaked images of internal parts.
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However, iPhone 6 is long rumoured to come with NFC support that would enable e-payment functionality. Apple is also expected to bring the 802.11ac Wi-Fi support that is available in most of Apple’s Mac line-up and is also more likely a natural upgrade for the next iPhone.
The leaked images reveal a simply bare logic board, with neither the rumoured Wi-Fi chip, nor RAM or even the speculated A8 processor soldered on the logic board.
One of the leaked images show the comparison of iPhone 5S logic board and the yet-to be announced iPhone 6’s logic board set side by side. Notably, the iPhone 6 logic board has a part towards the top of device is much longer, compared to that of iPhone 5S.
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The logic board in the leaked image bears a number of similarities with other iPhones corresponding parts. MacRumours notes that the screw holes in the logic board seem to be in line up with the recent leaks of the rear shell parts of the iPhone 6.
Apple is expected to launch the next generation device in 2 different variants – 4.7-inch and 5.5-inch models in September this year.
